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Senior Engineer I, Operations Engineering-Mfg Eng-AS

Kulicke & Soffa · Singapore

Semiconductor packaging equipment process engineer responsible for qualification, verification, and optimization of bonding equipment and processes, including process development, metrology protocol establishment, and manufacturing process monitoring.

Requirements

Experience: 5+ years

Education: BACHELOR

Required

chip manufacture processDesign of experiments (DOEs)Die-Bonding Process DevelopmentJMPMinitab/JMPProblem-solvingStatistical methodsThermocompression BondingWire Bonding Process Development

Preferred

Python

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