We are seeking a highly motivated Mechanical Engineering intern to assist in the development and validation of an automated high-precision mechanism designed to mate optical connectors to Silicon Photonic (SiPh) and Co-Packaged Optics (CPO) devices.In this role, you will bridge the gap between mechanical design and real-world performance. Your primary focus will be to test, evaluate, and characterize the automated system to identify its operational limits, ensuring sub-micron repeatability and long-term reliability in a high-stakes semiconductor testing environment.
- Primary Responsibilities
- System Characterization: Execute complex test plans to quantify the performance of automated mating hardware, focusing on precision, repeatability, and force profiles.
- DOE & Limit Testing: Design and conduct Design of Experiments (DOE) to identify failure modes related to mechanical misalignment, thermal drift, and component wear.
- Data-Driven Analysis: Collect and process mechanical and optical performance data to define the "Safe Operating Area" for the automation platform.
- Hardware Iteration: Design and prototype custom jigs, fixtures, and end-of-arm tooling (EOAT) to improve alignment accuracy and connector protection.
- Failure Mapping: Create a "Failure Catalog" documenting the mechanical and optical thresholds where the system performance degrades (e.g., insertion loss spikes or physical material wear).
- Currently pursuing a BS or MS in Mechanical Engineering, Mechatronics, or a related field.