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Senior Process Engineer - Advanced Packaging

ASM International · Finland > Helsinki

Senior Process Engineer specializing in 3D Integration and Advanced Packaging, developing cutting-edge thin film processes and atomic layer deposition (ALD) technologies for semiconductor applications.

Requirements

Experience: 3+ years

Education: PHD

Required

Advanced processing techniquesAtomic Layer Deposition (ALD)Hardware interface integrationSemiconductor materialsSemiconductor Process Engineering

Preferred

3D integration (W2W, D2W bonding)Advanced packaging or emerging device structuresALDCVDPVDSCBASemiconductor Industry experienceThin film processesTrigonometryWRAXPSXRDXRF

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