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Senior Engineer, Mechanical Engineering (Advanced Packaging)

ASM International · Taiwan > Hsinchu

Lead the design and development of next-generation semiconductor process equipment as part of ASM's Advanced Packaging team, managing system architecture, automation strategies, and cross-functional collaboration to deliver innovative solutions.

Requirements

Experience: 8+ years

Education: BACHELOR

Required

Analytical and troubleshooting skillsComplex mechanical systems design (reactors, vacuum chambers, gas delivery systems, pneumatics, water cooling circuits, vacuum systems)Creo ParametricGitMechanical EngineeringPLC based controls systemsPLC programmingSCADASemiconductor capital equipment design and development

Preferred

ASME Y14.5 standardsAutoCAD ElectricalCECreoInterpersonal skillsISO 22301Materials knowledge (ferrous and non-ferrous metals, Ceramics)Metal deposition productsNFPA 79Power AppsSemi S2Semiconductor Capital Equipment

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