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3DI部(3Dimension Integration Dept.)/技術マーケティング(担当/Leader)

Tokyo Electron (Japan) · 東京都港区

Technology Marketing role in the Advanced Package semiconductor manufacturing equipment division, focusing on bonding, wafer thinning processes, and laser-based applications for high-density packaging.

Requirements

Experience: 0+ years

Required

Collaboration toolsEnglish LanguageInterpersonal skillsProduct MarketingSemiconductor backend and packaging processesSemiconductor Industry experienceTOEIC Certification

Preferred

Advanced PackageAsia-Pacific region experienceBonding technologyKoreanLaser processingoperation and business experiencePackagingProcess Engineer backgroundWafer preparation

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