Process Engineer – Die to Wafer Hybrid Bonding

Applied Materials · Santa Clara,CA

Process Engineer role developing die-to-wafer hybrid bonding processes for silicon photonics and co-packaged optics applications within Applied Materials' Photonics Platforms Business Group.

Requirements

Education: MASTER

Required

Statistical analysis and process control (DOE, SPC, JMP)Wafer to Wafer Bonding

Preferred

2.5D/3D integrationAlignment and overlay fundamentalsBond interface physicsDirect process engineer experience on mainstream semiconductor equipment (plasma, wet clean, overlay/alignment)Mechanical behavior of thin and fragile diesThin-die handling and alignment-critical processes

Process Engineer – Die to Wafer Hybrid Bonding

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