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Advanced Packaging Process Support Engineer

Applied Materials · Icheon-Gwango,KOR

Process Support Engineer to support Applied Materials KINEX bonding equipment in advanced semiconductor packaging, providing on-site technical support for die-to-wafer bonding technologies in high-volume manufacturing environments.

Requirements

Experience: 3+ years

Education: BACHELOR

Required

AnnealAnneal and ImplantApplied KINEX bonding systemsAtomic Layer DepositionChemical Vapor DepositionDesign of experiments (DOEs)English proficiency (writing, speaking, reading)Equipment supportPackagingPhysical Vapor DepositionPlasma Reactive Ion EtchRoot-Cause AnalysisSemiconductor Process EngineeringTechnical Communication

Preferred

Advanced backend packaging processesDie to Wafer BondingFlip Chip BondingFusion BondingHybrid bondingMaster's degree or PhDPlasma processesTC BondingWafer to Wafer BondingWet cleans

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