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Director, Module Process Engineer

Applied Materials · Icheon-Gwango,KOR

Customer-facing technical role identifying high-value service opportunities and resolving complex semiconductor equipment issues. Requires expertise in packaging, integration, FDC, and data analytics with strong problem-solving and leadership capabilities.

Requirements

Education: BACHELOR

Required

Data integrationDefect troubleshooting methodologiesDFTpMetrologyPackaging

Preferred

Advanced integration knowledgeMaster's degree in related field

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