Process Integration Engineer

Applied Materials · Santa Clara,CA

Engineering expert role in advanced semiconductor packaging at Applied Materials, responsible for developing new modules and driving innovation in W2W/D2W bonding, TSV, and thermal management across Applied's product portfolio.

Requirements

Experience: 10+ years

Education: BACHELOR

Required

Applied Problem Solving TechniqueCross-functional Team LeadershipD2W bondingData integrationDeposited thin film dielectricsDesign of experiments (DOEs)Device physicsInterpersonal skillsManufacturingMechanical EngineeringMicro bumpsMulti-wafer stackingOptical modeling and simulationPolymer dielectricsProject and Program ManagementSemiconductor backend and packaging processesThermal ManagementTSV (Through-Silicon Via)W2W bonding

Process Integration Engineer

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