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Technical Director, Advanced Packaging Integration

Applied Materials · Singapore,SGP

Advanced Packaging Technical Director leading next-generation 2.xD packaging process integration and materials development for large form factor substrates at Applied Materials' Advanced Packaging division.

Requirements

Experience: 5+ years

Education: MASTER

Required

Advanced 2.xD packaging technologiesCross-functional Team LeadershipDesign of experiments (DOEs)Dry EtchFailure AnalysisFan-out panel-level packaging (FOPLP)JMPLithographyMaterials modifications processesMetrologyOrganic interposerProcess characterizationReliability requirements and qualification methodologiesStatistical methodsSubstrate technologyTechnical CommunicationThin film processesWafer-level back-end technologies

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